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Recently, Xiamen Tongshida Lighting Co., Ltd. announced that it will develop a new generation of lighting products using Taiwan-based solid-state lighting package-free POD light source devices.
After the package is omitted, the overall cost of the LED component will be reduced again. This is the cost theory frequently heard by reporters in the interview. The emergence of these package-free chips has made many packaging companies located in the middle of the LED industry chain feel at risk. Is it a crisis and a battle? Still the best?
Opportunities and Challenges Free packaging is not without packaging. The industry said that although the package-free technology has been proposed for some time, other companies in the country except Guangzhou Jingke have not yet mass production, so the market share is almost zero. According to industry insiders, in terms of LED lighting product manufacturing process, it is divided into Level0 to Level5 manufacturing process, in which Level0 is the process of epitaxial wafer and chip, while Level1 will package LED chip, Level2 will solder LED on PCB, Level3 For the LED module, Level 4 is the illumination source and Level 5 is the illumination system. The LED factory's unpackaged chip technology mostly omits the development of Level1.
The package-free package is actually a gold-free package, but a gold-line package process is missing. Li Jiansheng, chairman of Shanghai Dinghui Technology Co., Ltd., said that all chip implants are packaged, and each device must be packaged. The package-free chips that appear on the market today are not unpackaged devices, and the two are fundamentally different.
The packaging process may disappear and the industry chain becomes more likely to become two links. Chen Bin, general manager of Guangdong Zhonglong Transportation Technology Co., Ltd. put forward three reasons: First, the improvement of chip technology has left fewer and fewer processes for the packaging process; second, the past LED application products did not form a relatively uniform standard light source, and the package After the LED to the application manufacturer to re-process to form a usable light source, as the standardized light source becomes a major trend, it will gradually compress the space of the packaging link; Third, the market competition is intensifying, making the profit margin smaller and smaller, upstream chip manufacturing The Chamber of Commerce directly completes the packaging process and even achieves the standardization of the light source.
With the transformation of packaging technology, traditional packaging companies will face a crisis of survival. Ruan Xiaoming, technical director of Ruifeng Optoelectronics, said that once the chip-level packaging technology is emerging, upstream chip manufacturers may directly skip the package manufacturers to provide lamp beads to downstream application vendors, and the traditional mid-stream package manufacturers will be short-circuited.
Chen Haijun, director of the Optoelectronics Research Institute of Ningbo Liaoyuan Lighting Co., Ltd., preliminarily judged that the upstream epitaxial chip companies will do a good job in the future, and large-scale general-purpose products can be directly selected. However, the characteristics of LEDs determine the variety of products. Therefore, a chip factory cannot meet all the application needs of downstream enterprises. LEDs will not only be used for lighting, so special forms, appearances, types, etc. are required for some special and customized applications. The package will still exist, but it is no longer a necessary link.
Free packaging is an inevitable trend in technology development. Yan Chongguang, a professor at the Shanghai Institute of Microelectronics, Peking University, believes that the LED chip manufacturing technology is undergoing major changes. The ELC chip without packaging has been successfully developed and produced in Taiwan's Jingyuan Optoelectronics two years ago. Guangzhou Jingke Electronics is also producing. The high-voltage LEDs developed and produced by the LED chip factory, which are generated on the wafer, have also been released and promoted in some cities. However, small particle LED chips still need to be packaged for application.
The mid-stream packaging enterprises need to sit on the ground revolutionary development trend will definitely bring a huge impact on LED packaging companies, but as the entire LED industry chain packaging links will not disappear. Ye Likang, deputy general manager of Xiamen Hualian Electronics Co., Ltd. believes that LED's existing applications are very extensive, and will continue to innovate in the future, and different applications must have the most suitable LED solutions, so various LED products will coexist. The package product has its own space. In addition, when chip-level package products are mature, chip flip-chip eutectic does not need to be packaged, LED products still need to solve a series of problems such as heat dissipation, optics, weather resistance, reliability, etc., packaging is indispensable.
In the view of Yan Chongguang, the LED packaging factory is the only way to develop modularization. The LED packaging factory can develop LED light source modules, develop multi-core packages, and develop photoelectric engines with driving power supply chips and LED light sources on the side of the aluminum substrate.
Packaging companies cannot disappear, and advances in LED technology will give the packaging sector greater market space and innovation space. Zhang Sun, general manager of Ningbo Shengyu Opto Semiconductors Co., Ltd. believes that the LED market has now penetrated into general lighting, landscape lighting, special lighting, backlighting, display, including security equipment, home appliances, automobiles, communications and even more new areas, which will give Packaging companies have more room for development. At present, LED lighting is in the era of replacement, and may enter the era of creative products in the future, but no matter what era, people's requirements for light quality will be higher and higher, and many of the technical problems can only be solved by the packaging process. With the development of new technologies, decapsulation will only be applied to some lighting products, but it is still unclear whether the products to be packaged can maintain high quality and high performance.
Looking back at the packaging products of a few years ago, great changes have also taken place, which is the change in technology brought to the package. In Zhang Sun's view, LED packaging factories should actively adapt to this new change and innovate product structure. He predicted that there will be two main trends in packaging in the future. One is that standardized low-cost products are now mainstream products; the other is that high-level, high-applicability packaging products will be the mainstream products in the future, so packaging manufacturers should do well. Prepare for any changes.
Change your life and live for the benefit of the LED industry chain, the package is in the middle reaches, has been integrated upstream and downstream. Of course, some midstream package companies have also chosen to integrate downstream or upstream. The industry predicts that in the future, with the continuous integration of LEDs and the emergence of leading brand enterprises, packaging capacity will inevitably be concentrated in large enterprises. The improvement of technological processes will inevitably promote industrial development, promote product efficiency improvement and cost reduction, and accelerate popularization and penetration.
The packaging process may be transferred directly to both ends of the industry. Luo Wenzheng, general manager of Xi'an Company of Sichuan Xinli Light Source Co., Ltd. believes that on the one hand, there are many new technologies and processes in upstream chip manufacturing. For example, wafer-level packaging is the simultaneous completion of packaging in the upstream chip manufacturing process, eliminating the need for packaging companies. On the other hand, the current packaging process is gradually being eaten by downstream luminaires, which means that it is directly integrated into a process of luminaire manufacturing. For example, the COB technology developed very well in recent years is very representative, many lamps The manufacturer has a packaging link that eliminates the need to purchase LED packaged devices from standard package manufacturers. From this point of view, if the mid-stream packaging enterprises want to carry forward, they must be close to the upstream and downstream.
Under the impact of no packaging technology, the marketization and scale of the midstream packaging field in the future is an inevitable trend. A research center related person said that the realization of scale requires the integration of the industry chain up and down. On the one hand, it cooperates with chip companies, on the other hand, it enters the downstream application field. Since this gold-free and bracket-free packaging process can be directly completed by chip companies, packaging companies need to actively explore more living space upstream or downstream, such as using years of experience in the packaging field, and working with chip companies to complete the part. Process, etc.
The integration of chip manufacturers and packaging manufacturers is an inevitable trend in the industry. Yan Xiaoming also believes that some manufacturers have begun to try the mid-stream integration of the industry chain, and individual companies have even integrated the entire industry chain.
Since the LED packaging will not disappear, who will do it will bring more value and convenience to the terminal products. Therefore, as an LED packaging company, it must be safe. Ye Likang put forward three suggestions: First, do a good job in positioning and strive to achieve the top in the scale of the field; second, through technological innovation, improve the technical level of packaging technology, continue to reduce lumen costs and improve light color quality, keep up with COB, , EMC and other technologies, as well as chip flip-chip eutectic or solder paste reflow process, fluorescent film packaging, remote phosphors and other new technologies and new processes; the third is to give full play to the advantages of packaging companies to facilitate integration, for specific applications Providing an optimized packaging solution and extending the package module with drive and control unit downwards, through joint innovation with upstream and downstream, to meet the requirements of terminal product dimming, color grading, simulated solar spectrum, and intelligent. As long as the packaging enterprises do better than the upstream and downstream enterprises involved in the packaging process, and have more cost advantages, and can create real value for the end customers, they will be able to form a good pattern of mutual benefit and win-win in the LED industry chain.