Lead-Free Solder Bar Tin-Silver-Copper (Sn96.5/AG3.0/Cu0.5)

Weight: 500g/PC
Trademark: Xifeng, OEM
Transport Package: Carton
Specification: 3.15cm * 1.5cm * 1.0cm
Origin: Shunde, Foshan, China
HS Code: 831130000
Tin Lead Free Solder Bar:

Our company provides Tin Lead Free Solder Bar with a variety of alloy composition , content and size of the diameter of pharmaceutical different specifications tin for customer choice. 
Lead-Free Solder Bar Tin-Silver-Copper (Sn96.5/AG3.0/Cu0.5)

Tin Lead Free Solder Bar Type of Alloy:
Alloy composition (wt.%) Diameter Flux Content Weight / Roll Melting pointºC Working point Usage & Application
Type Tin-Sn Silver-Ag Copper-Cu
SAC305 96.50% 3.00% 0.50% 0.8-3.0mm 1.8-2.4% 750-1000g 217-219  280-320 LED, IT, PCB, High-class electronics, Lighting industry, Radiators, Household appliance and Precise Instruments, Audio and Sound System and other soldering
SAC300 97.00% 3.00% 0% 217-220 280-320
SAC0307 99.00% 0.30% 0.70% 217-225  260-320
SAC07 99.30% 0.00% 0.70% 227  260-280
Lead-Free Solder Bar Tin-Silver-Copper (Sn96.5/AG3.0/Cu0.5)

Type of Tin Lead Free Solder Bar:
  1. Anti-oxidation tin lead free bar
  2. High temperature tin lead free bar
  3. Low temperature tin lead free bar
  4. Dim tin lead free bar
  5. Silver tin lead free bar
  6. Tin lead free solder bar for other particular applications
Size of Tin Lead Free Solder Bar:
3.15cm * 1.5cm * 1.0cm

Weight of Tin Lead Free Solder Bar:
500g/PC

Advantages of Tin Lead Free Solder Bar:
  1. Eutectic alloy.
  2. Bridge-free and icicle-free soldering.
  3. Smooth, bright, well-formed fillets, free of gross micro-cracks, irrespective of the cooling rate.
  4. Good through-hole penetration.
  5. Good topside fillet formation.
  6. Dross rate equal or lower than tin-lead solder.
  7. Does not require a nitrogen atmosphere.
  8. Does not erode copper from holes, pads and tracks.
  9. Low rate of copper leaching makes it easy to control the copper content of the solder bath.
  10. Lower aggressiveness to stainless steel and other solder pot materials as compared to tin-silver-copper alloys.
  11. Thermal fatigue resistance and creep strength better than tin-lead.
  12. Slow, even growth of the intermetallic layer at the solder/substrate interface.
  13. Also performs well in selective and dip soldering.
Lead-Free Solder Bar Tin-Silver-Copper (Sn96.5/AG3.0/Cu0.5)

Lead time: 
We have a lot of stock of Tin Lead Free Solder Bar, if not very big quantity, we can send the goods as soon as possible after receive payment. If big quantity, 10days after order confirmed. 
 
Shipping term: 
If small quantities of tin lead solder bar, usually send by courier (DHL, FEDEX, TNT and so on).If big quantity, we are advice to ship by air or by sea. We are near Foshan, Ronggui port.

Packing:
Solder bar is packaged with carton
Neutral packing or OEM packing is available

Spectrum Analyzer:
Technical support to help customers to analyse their samples, and send out report.
Lead-Free Solder Bar Tin-Silver-Copper (Sn96.5/AG3.0/Cu0.5)
 

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